The aim of the project “Investigation on technology of UV-crosslinkable hot-melt
adhesives containing
new UV-photoinitiators” is to work out a technology of pressure-sensitive hot-melt
adhesives based on (meth)acrylics (abbreviated as UV-HMPSA). These adhesives will be able to
UV-crosslinking owing to incorporation of new photoinitiators (FI-K), which will be
developed during this project. These UV-HMPSA adhesives can be successfully used for
manufacturing
of wide range of self-adhesive materials, such as self-adhesive tapes, labels, signs
and marking films and self-adhesive medical materials. UV-HMPSA will be obtained by
polymerization
processes of selected (meth)acrylic monomers and copolymerizable photoinitiator (FIK) in
selected
organic solvents. After the process, the organic solvents will be removed in distillation
process
(under vacuum). In order to obtain low-viscosity adhesive compositions,
modification of the solvent-free adhesives (using photoreactive diluent and other
photoinitiators)
will be performed. The solvent-free hot-melt adhesives will be applied at 140°C by means of
special coating machine (or at lover temperature in the case of low-viscosity adhesive
compositions)
and then UV crosslinked using UV lamp (also LED diodes). The aim of the project will be
realised by:
(i) synthesis and characteristic of novel unsaturated (copolymerizable) photoinitiators
(FI-K);
(ii) synthesis of novel (meth)acrylate copolymers containing FI-K photoinitiators and new
acrylic
monomers and photoinitiators (also developed by Polish universities);
(iii) characteristics of self-adhesive properties of the hot-melt adhesives;
(iv) test in half-technique scale;
(v) preparation of demonstrative installation project.